JPH0287562U - - Google Patents
Info
- Publication number
- JPH0287562U JPH0287562U JP16656288U JP16656288U JPH0287562U JP H0287562 U JPH0287562 U JP H0287562U JP 16656288 U JP16656288 U JP 16656288U JP 16656288 U JP16656288 U JP 16656288U JP H0287562 U JPH0287562 U JP H0287562U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- nozzle
- substrate
- applicator
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000006071 cream Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16656288U JPH0287562U (en]) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16656288U JPH0287562U (en]) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287562U true JPH0287562U (en]) | 1990-07-11 |
Family
ID=31454055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16656288U Pending JPH0287562U (en]) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287562U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09141163A (ja) * | 1995-11-15 | 1997-06-03 | Unisia Jecs Corp | 接着剤塗布装置 |
-
1988
- 1988-12-23 JP JP16656288U patent/JPH0287562U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09141163A (ja) * | 1995-11-15 | 1997-06-03 | Unisia Jecs Corp | 接着剤塗布装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3656533B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
| TWI472281B (zh) | 糊膏印刷機及以糊膏印刷的方法 | |
| JPH0768730A (ja) | ハンダ・ペーストをプリント配線基板上に均一に付着させる装置および方法 | |
| JPH0287562U (en]) | ||
| JPH0487562U (en]) | ||
| JP2002141642A (ja) | 電子部品実装方法 | |
| JPH0530512B2 (en]) | ||
| JP2513413B2 (ja) | フラックス塗布装置 | |
| JPH10233415A (ja) | 導電性ボールの半田付け用フラックスの塗布装置 | |
| JPS62118668U (en]) | ||
| JP4263347B2 (ja) | 電子部品実装装置におけるペースト供給装置 | |
| JPS6121170Y2 (en]) | ||
| JPS62204591A (ja) | 電子部品の取り付け方法及び装置 | |
| JPH0238169U (en]) | ||
| JPH08167772A (ja) | 表面実装電子部品の予備はんだ付け方法 | |
| JPH05138343A (ja) | フラツクス塗布装置 | |
| JP3324459B2 (ja) | プリント基板半田付け装置のセンターキャリア | |
| JPS6213731Y2 (en]) | ||
| JPH0362665U (en]) | ||
| JPH0423287Y2 (en]) | ||
| JPH0483473U (en]) | ||
| JP3240853B2 (ja) | クリーム半田の塗布装置および塗布方法 | |
| JPS6057944B2 (ja) | 噴流式はんだ槽 | |
| JP2580458Y2 (ja) | フォームソルダー供給材 | |
| JPH0356120U (en]) |